Warped Worlds: The Package Puzzle

In 'Warped Worlds: The Package Puzzle', players take on the role of a packaging engineer tasked with assembling advanced heterogeneous packages while controlling warpage. Utilize molding compounds, modeling techniques, and creative architectures to optimize multi-chiplet systems and ensure long-term reliability. Navigate through the challenges of varying coefficients of thermal expansion, die thickness, substrate types, and material properties to conquer the ultimate packaging puzzle.